Plasma-Erosion Resistant Coatings for Semiconductor Process Chambers

The Challenge

Plasma-etch chamber components and electrodes used in semiconductor fabrication equipment are continuously exposed to aggressive plasma environments.

Over time, plasma erosion can generate particles that contaminate the process environment, negatively impacting yield and increasing maintenance requirements. In addition, replacement of high-value chamber hardware can be extremely costly.

The Solution

Plasma Spray Processors applies high-purity Al₂O₃ (Alumina) and Y₂O₃ (Yttria) APS coatings to critical chamber components and electrodes to improve resistance to plasma erosion and corrosion.

These coatings provide durable dielectric surfaces while helping control particle generation. Existing chamber hardware can also be refurbished through a specialized re-coating process.

• High-purity Al₂O₃ and Y₂O₃ coatings for plasma-etch applications.
• Excellent dielectric and corrosion-resistant surface properties.
• Suitable for process chambers, electrodes, and critical semiconductor tooling components.
• Re-coating service available for refurbishment of existing hardware.

The Result

• Improved resistance to plasma erosion.
• Reduced risk of particle contamination within process chambers.
• Extended operational life of high-value chamber hardware.
• Lower capital expenditure compared to purchasing new chamber components.